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Phenyl silicone rubber elastic putty: a multifunctional material for flexible protection and high-temperature sealing

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In the fields of aerospace, precision electronics, energy, and industrial equipment maintenance, materials must not only possess high elasticity and plasticity but also withstand the long-term challenges of high temperatures, radiation, and complex chemical environments. Phenyl silicone rubber elastic mortar, a new, non-flowing, highly plastic, room-temperature curing material, is becoming an ideal choice for sealing, potting, and protection in various industries due to its unique structure and outstanding overall performance.



Phenyl silicone rubber elastic cement is based on polysiloxane with a high phenyl content, enhanced with special tackifiers, inorganic fillers, and heat-resistant additives, resulting in extremely high thermal stability (resistant to temperatures up to +300°C), excellent dielectric properties, and long-term flexibility. Its most significant feature is that it remains soft even under heat, pressure, and chemical attack, allowing for repeated shaping, caulking, and sealing capabilities.

This material is widely used in:

Filling gaps and providing vibration damping between aerospace cabins and sealed structures;

Heat-resistant electrical potting for high-voltage substation equipment and precision sensors;

Flame-retardant gap filling for lithium battery modules and power battery housings;

Temporary or long-term gap repair and leak prevention during operation of mechanical equipment.

Its flexible properties also provide excellent adaptability to complex curved surfaces or irregular structures. Application is simple, requiring no pressurizing equipment, and curing is bubble- and crack-free, significantly improving on-site repair and product reliability.

With the advancement of smart manufacturing and high-end equipment technology, phenyl silicone rubber elastic mortar is undergoing continuous improvement and upgrades, such as the introduction of low-volatility and low-ion migration formulas. These improvements enhance its performance in semiconductor and clean electronics environments, making it a representative next-generation flexible, high-temperature sealing material.

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