RTV does not require heating and can cure under natural room temperature conditions. Both high-temperature and low-temperature adhesives require heating to form HTV, and the direct difference between high-temperature and low-temperature adhesives is only the heating temperature.
HTV silicone rubber originally refers to high-temperature vulcanized silicone rubber, but attentive customers often still hear silicone factories talk about high-temperature rubber and low-temperature rubber. Why is there still a saying about high temperature and low temperature when it is already high-temperature vulcanized silicone rubber?

It has to be added that RTV and HTV have the most fundamental difference in curing conditions (vulcanization system). RTV does not require heating and can cure under natural room temperature conditions. Both high-temperature and low-temperature adhesives require heating to form HTV, and the direct difference between high-temperature and low-temperature adhesives is only the heating temperature. For example, high-temperature glue usually needs to be heated to around 160 ℃ during the molding process. During the molding process, low-temperature adhesive only needs to be heated to around 90 ℃. There is no difference in the raw materials used between the two, except for the addition of different vulcanizing agents.

Anything that exists is reason!
High temperature rubber, due to its high vulcanization molding temperature, can greatly shorten the molding time, greatly improve production capacity, and reduce the cost of silicone rubber products. However, in some silicone rubber products that require the integration of plastic parts, FPCs, and circuit boards, if the molding temperature is too high, these implanted parts are easily damaged. However, due to the limitations of its vulcanization system, high-temperature adhesives are difficult to vulcanize and form when the temperature is low enough to not damage the implanted parts.

Silicone encapsulation low-temperature molding
Therefore, low-temperature adhesive has emerged. Low temperature adhesive only requires a temperature of about 90 ℃ to complete vulcanization molding. At this temperature, almost all plastic parts, FPCs, circuit boards, and other embedded and molded parts can withstand no damage or deformation. And it can achieve a vulcanization time close to that of high-temperature glue. Therefore, low-temperature adhesive is applied to silicone rubber products that require encapsulation molding, such as silicone wrapped plastic, silicone wrapped FPC, silicone wrapped circuit boards, etc.