Electronic potting adhesive is a special adhesive used for packaging and fixing electronic components. It is usually a high-performance engineering grade adhesive used to protect electronic components from external environmental influences such as moisture, dust, mold, and chemical corrosive substances. Electronic potting adhesive can improve the reliability and durability of electronic components, thereby extending their service life.

Electronic potting adhesive plays an important role in the electronic manufacturing process, especially in the manufacturing of high-density integrated circuits, electronic modules, sensors, and other small electronic devices. Its main functions are as follows:

Moisture and dust prevention: Electronic potting adhesive can form a sealed barrier around components to prevent moisture and dust from entering, thereby reducing the risk of component damage.

Shock resistance and vibration reduction: Electronic potting adhesive can enhance the structural strength of electronic components, reduce the impact of mechanical vibration and impact on components, and improve their seismic performance.

Insulation: Electronic potting adhesive has excellent insulation performance, which can effectively prevent current leakage or short circuits between electronic components.

Heat dissipation: Some special electronic potting adhesives also have good thermal conductivity, which can be used to help dissipate heat and prevent component overheating.

Chemical resistance: Electronic potting adhesives typically have corrosion resistance and can protect components from chemical attack.

Common types of electronic potting adhesives include epoxy resin, silicone, polyurethane, etc. The selection of a suitable sealing adhesive depends on the specific requirements of the application, such as temperature range, chemical resistance, bonding performance, etc.

When using electronic potting adhesive, it is necessary to pay attention to the use of appropriate processes and equipment to ensure the correct application and curing of the adhesive, in order to ensure the best effect and performance.